Samsung is looking to reduce its dependence on chip suppliers as the company announced the mass production of its Exynos 7 Dual 7270 chip. The dual core processor chip is specifically designed for wearables such as smartwatches. It uses Samsung's 14nm FinFET process technology and comes with LTE modem.

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The Exynos 7 Dual 7270 chip is expected to very power efficient as it can boost battery life by as much as 20 percent. The chip comes with a pair of Cortex-A53 cores and features embedded Bluetooth and Wi-Fi connectivity. It also has Cat. 4 LTE 2 CA modem.

Ben K. Hur, vice president of System LSI Marketing at Samsung Electronics, said that the chip brings a "new paradigm for system-on-chips (SoC) dedicated to wearables." The chip offers more efficient power usage along with a 30 percent lower height than its predecessors. These qualities make the chip ideal for wearable tech products, where size and efficiency are important.

The Korean tech giant used embedded package on package (ePoP) and System in Package (SiP) technologies for designing this chip. These technologies would enable the company to pile various flash memory chips and power management IC onto the processor. Samsung claims that this is the first wearable-centric chip to employ 14nm FinFET technology.

Samsung did not name the products which might be using this chip. However, it announced the availability of a reference platform for customers and device manufacturers. The platform consists of the Exynos 7270, NFC and other sensors.