Qualcomm has been always leading the pack when it regards to raw mobile processing power, especially with their latest Qualcomm Snapdragon 8xxx chipsets.

However, it appears that the company's dominance will come to its end as latest reports claim that Mediatek and the Taiwan Semiconductor Manufacturing Company (TSMC) are allegedly developing a brand new mobile processing unit now using a cutting-edge 7nm manufacturing process.

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DigiTimes reports that both companies are in the works of developing their next generation mobile processors which is said to have a total of 12 cores embedded into it. The aforementioned 7nm manufacturing process makes that possible. For comparison, the Qualcomm Snapdragon 835 chipset, which is one of the most powerful mobile CPUs up-to-date, uses the currently available 10nm manufacturing process.

Mediatek currently offers several products that are based on the 10nm manufacturing process as well. Some of which include the Deca-core Helio X25 and X20 chipsets. Moreover, the company is also in the process of finalizing the Helio X30, their latest 10nm-based flagship. It is said slated to be released sometime this 2017.

The company's CPU offerings, which are reportedly equipped with 10 CPU cores, are more than enough powerful in comparison to other competing chipsets. However, it appears that Mediatek will not be satisfied until they build the most powerful chipsets that will be commercially available and eventually dethrone Qualcomm.

If they do succeed in building mobile processors which are based on the 7nm manufacturing process, then there is a high possibility for the new CPUs in surpassing the performance and power savings of any 10nm-based mobile CPUs that are currently available.

Furthermore, GSM Arena details that TSMC and Samsung seem to be working together to mass produce the new chips early next year. Given that in 2018, there would be a proliferation of 12-core smartphones, the upcoming Samsung Galaxy S9 would likely be the first to sport the new CPU.